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Series
Microelectronics International volume Volume 35, Number 3
Publisher
Emerald Publishing Limited
Pub. Date
2018.
Language
English
Series
Microelectronics International volume Volume 34, Number 3
Publisher
Emerald Publishing Limited
Pub. Date
2017.
Language
English
Series
Key engineering materials volume 596
Publisher
Trans Tech Publications
Pub. Date
2014.
Language
English
10) Imaps 2019
Series
Soldering and Surface Mount Technology volume Volume 32
Publisher
Emerald Publishing
Pub. Date
2020.
Language
English
16) Silicon run lite
Publisher
Ruth Carranza Productions
Pub. Date
[2004, 1997]
Language
English
Description
Combines key sequences and images from both "Silicon Run I" and "Silicon Run II". Overview of how microchips are made and assembled into computers.
17) Silicon run: I
Publisher
Ruth Carranza Productions
Pub. Date
[2004, 1996]
Language
English
Description
Explains how integrated circuits work. Takes the viewer through the integrated circuit manufacturing process or the "silicon run." Illustrates front-end manufacturing, from crystal growth through IC fabrication. It includes 200 mm (8 in.) crystal growth, molecule structure, p-type/n-type doping, wafer slicing and polishing, CAD/CAE design, mask making, and multi-layered CMOS fabrication.
Publisher
Ruth Carranza Productions
Pub. Date
[2004, 1993]
Language
English
Description
Follows the manufacturing process by which IC wafers are made into chips used in microcomputers and multichip units of high-end computers. Illustrates back-end manufacturing from testing through packaging, PC board design and assembly, systems assembly, computer structure, and multichip technology.
Series
Microelectronics International volume Volume 33, Number 3
Publisher
Emerald Group Publishing Limited
Pub. Date
2016.
Language
English
